Tuesday, July 28, 2009

Third-generation ICP source improves DRIE productivity and yield for MEMS and 3D IC market applications; worldwide ProNova User Group accelerates DRIE learning cycles with multi-site process demonstration capabilities

TOKYO, Japan and PETALUMA, Calif., July 28, 2009—Tegal Corporation, (Nasdaq: TGAL) an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices, today launched ProNova™, the company’s third-generation high-density Inductively Coupled Plasma (ICP) reactor for Tegal DRIE Series Wafer Processing Products.  Targeted for fast-growing MEMS and 3D IC applications, delivery of the ProNova has already begun, with the first order going to a new Tegal customer in the EU (see related announcement).

Separately today, Tegal also announced the ProNova User Group, a global network of ProNova DRIE process demonstration sites in Europe, North America, and Japan.  Advanced characterization work and customer process demonstrations are already being carried out in the greatly expanded process window opened by ProNova.

Tegal’s new DRIE reactor arrives on the market just as the focus of MEMS foundries and MEMS device makers turns increasingly to 200mm fabrication.  During the recent Extreme MEMS program at SEMICON West 2009, Yole Developpement, a leading market research firm reporting on MEMS business and technical activities, clearly identified trends in 200mm MEMS device fabrication.  According to Yole, MEMS fabrication on 200mm wafers will grow more than 2.6 times over the period 2009 – 2012.  Drivers for 200mm MEMS growth include the significant yield and cost advantages inherent in 200mm processing, along with the added benefit of being able to perform CMOS, MEMS, and heterogeneous integration processing with advanced 200mm tool sets.  A key challenge for 200mm MEMS fabrication is porting established MEMS processes onto 200mm tools and then improving on the baseline process results; for silicon DRIE, these challenges include achieving higher etch rates, tighter control of tilt angles and etch profiles across 200mm wafers, and tighter control of etch depth uniformity across 200mm wafers.

The Tegal ProNova™, Tegal’s third-generation high-density ICP reactor, was developed to address each of the key market requirements identified by the 200mm MEMS community.  As a result of improved ICP reactor geometry and plasma source design, ProNova, when compared to standard ICP sources, achieves superior etch depth uniformity, etch profiles, and etch tilt angles across 200mm wafers.  Additionally, the larger process window created by expanding the effective operating ranges of the plasma source and diffusion chambers results in higher etching rates overall, a key enabler for DRIE tool productivity.

“The attention right now in MEMS production and 3D IC packaging is squarely on 200mm applications,” said Paul Werbaneth, Vice President of Marketing and Applications at Tegal.  “ProNova, our third generation DRIE ICP source, offers significant advantages over standard ICP sources on larger diameter wafers, with the end results being better productivity and higher yields on 200mm wafers for MEMS and 3D IC customers.”

The ProNova ICP source is available immediately to ship on Tegal 110, 200, 3200, and 4200 DRIE Wafer Processing Systems.  ProNova is also compatible as a retrofit with Tegal and AMMS DRIE systems already in the field, and ProNova supports SHARP – Tegal’s Super High Aspect Ratio Process, achieving etched feature aspect ratios of > 100:1 in production environments.

In support of the ProNova launch, Tegal is exhibiting at Micromachine/MEMS 2009, Tokyo Big Sight, Tokyo, Japan from Wednesday 29 July 2009 through Friday 31 July 2009.  Please look for Tegal and ProNova at the Canon Marketing Japan Booth, East Hall, Booth H-05.

Safe Harbor Statement

Except for historical information, matters discussed in this news release contain forward-looking statements within the meaning of Section 27A of the Securities Act and Section 21E of the Exchange Act.  Forward-looking statements, which are based on assumptions and describe our future plans, strategies and expectations, are generally identifiable by the use of the words "anticipate," "believe," "estimate," "expect," "intend," "project" or similar expressions.  These forward-looking statements are subject to risks, uncertainties and assumptions about the Company including, but not limited to industry conditions, economic conditions, acceptance of new technologies and market acceptance of the Company's products and services.  All forward-looking statements attributable to us or persons acting on our behalf are expressly qualified in their entirety by the cautionary statements in this paragraph.  For a further discussion of these risks and uncertainties, please refer to the Company's periodic filings with the Securities and Exchange Commission.

About Tegal Corporation

Tegal is an innovator of specialized production solutions for the fabrication of advanced MEMS, power ICs and optoelectronic devices found in products like smart phones, networking gear, solid-state lighting, and digital imaging.  The Company’s plasma etch and deposition tools enable sophisticated manufacturing techniques, such as 3D interconnect structures formed by intricate silicon etch, also known as Deep Reactive Ion Etching (DRIE). Tegal combines proven expertise with practical system strategies to deliver application-specific solutions that are robust and reliable, and deliver exceptional process quality and high yields at a lower overall cost of ownership.  Headquartered in Petaluma, California, the company has more than 35 years of expertise and innovation in specialized technologies, over 100 patents, and an installed base of more than 1900 systems worldwide. Please visit us on the web at www.Tegal.com.