The Tegal 200 SE™ is the best adapted DRIE solution for 3D-SiP and MEMS volume manufacturing. It is designed to achieve high throughput with low Cost of Ownership, thanks to extended cleaning frequency, limited edge exclusion, high etch rate, excellent process stability and high etch uniformity. The optimization of the Bosch process has shown ultra high Silicon etch rate, with unrivaled uniformity and repeatability leading to excellent process yield. The 200 SE results are obtained thanks to the use of a wide range of proprietary design and process improvements, such as the Tegal patented heated liner, and the patented S.H.A.R.P. (Super High Aspect Ratio Process) process.
200 SE™ is a trademark of Tegal Corporation