At the development stage of complex MEMS and 3D-IC components, a high degree of flexibility is required to process different kinds of wafers with a large variety of materials and constantly changing patterns and designs. The Tegal 110 SE provides a compact, intuitive, cost-effective solution for process development applications. The 110 SE allows multiple configurations, with minimum technical intervention. The design is based on more than 25 years of plasma processing technology experience, delivering superior etch performance. With its very high aspect ratio trench etch and profile control capabilities, the 110 SE offers the key technology to meet the specific deep silicon plasma etching requirements of MEMS designers and manufacturers.
110 SE™ is a trademark of Tegal Corporation
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