6510 HRe¯™Wafer Size: 100mm – 200mm
The Tegal 6510 HRe¯™ is a high-density CCP plasma etch tool featuring dual-frequency RF power application and magnetic plasma confinement. The system can be configured with one or two HRe¯™ etch modules on a high-vacuum cluster platform. Typical applications for the semiconductor industry include polysilicon/silicide gate etch, shallow trench isolation (STI) etch, selective anisotropic nitride etch (LOCOS and spacer), and anisotropic nitride and oxide hard mask open etch. The 6510 is optimized for device design rules down to 90nm.
HRe¯™ and Spectra™ are trademarks of Tegal Corporation