OEM Group Acquires Legacy Thin Film Etch and PVD Product Lines from Tegal Corporation
OEM Group Inc., equipment solution providers to worldwide makers of Silicon, MEMS, LED, RFID, Power Devices, and Photovoltaic devices, announced on March 23rd, 2010 the successful completion of the acquisition of Tegal Corporation's legacy Thin Film Etch and PVD product lines. In this acquisition, OEM Group adds the Tegal 900ACS™, 980ACS™, 6500 HRe¯™ and 6500 Spectra™ Series Thin Film Etch products to their "LEGENDS™" offering.
OEM Group will bring continued global support to existing Tegal Thin Film Etch customers, with an install base approaching 2000 systems; and, by integrating these world class technologies into their already deep product mix, OEM Group is well positioned to serve the growing number of customers in emerging markets, like MEMS, BAW, LEDs, and beyond.
All 6500 Series Plasma Etch systems feature either Tegal's patented dual-frequency HRe¯™ CCP process module technology. The production tested cluster platform design incorporated on all 6500 systems accommodates either one or two etch process modules for processing of 100mm to 200mm wafers. Each module can be configured to run independent processes—optimizing flexibility, minimizing downtime and maximizing wafer throughput. The 6500 system comes standard with one vacuum cassette elevator for wafer I/O. Optionally, a second vacuum cassette elevator or patented Rinse-Strip-Rinse™ corrosion passivation station may be added within the standard frame. Each system incorporates full cluster tool technology with the latest innovations in contamination control and factory automation. Tegal's 6500 Series systems have demonstrated their effectiveness in addressing the challenges of etching new materials in a production environment now and in the future.
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The Tegal 900ACS™ & 980ACS™ Series extend the most durable and most reliable non-critical plasma etch tools in the semiconductor industry. No other line of single wafer cassette-to-cassette etch systems in production today offers the value and rapid return on investment for non-critical plasma etch processes for 75mm to 200mm wafers. ACS delivers faster throughput, faster system calibration, touchscreen graphical user interface, integrated data logging, and factory automation support.
900ACS™, 980ACS™, HRe¯™, and Rinse-Strip-Rinse™ are trademarks of OEM Group, Inc.